| 摘要 |
The method involves providing an anchoring material i.e. hanging resin, for hanging portions (7p, 8p) of electric connection wires (7, 8) and anchoring the portions to a support body. An integrated circuit chip (6) is coated by a mechanical protection and coating material (9) except the portions of the wires. The coating material is partially removed around the portions by laser machining, where the removal of the material forms a groove joining the electric connection wires and opening at a surface of the coating material. An independent claim is also included for an electronic device comprising a module fixed in a cavity of a support body. |
