| 摘要 |
An electronic component mounting apparatus includes a mounting device (J) adapted such that the applying unit (11) applies adhesive to a substrate (1) located in a predetermined site, a mounting unit (8) mounts an LSI (15) onto the application of the adhesive, subsequently the applying unit (11) applies another adhesive onto the LSI (15), and the mounting unit (8) mounts a reinforcing plate (18) onto the application of the adhesive, a conveying device which conveys the substrate (1) with the LSI (15) and reinforcing plate (18) mounted in the predetermined site by the mounting device (J) to a heating site, and a heating unit (12) which bonds, by the application of heat, the LSI (15) and reinforcing plate (18) on the substrate (1) conveyed to the heating site. |
