发明名称 ETCHING SOLUTION COMPOSITION FOR METAL LAYER COMPRISING COPPER AND TITANIUM
摘要 PURPOSE: An etchant composition is provided to embody rapid etching rate, to have excellent etching performance, and to keep etchant for long time. CONSTITUTION: An etchant composition for a metal layer with copper and titanium comprises persulfate, a fluorine-containing compound, inorganic acid, a cyclic amine compound, a chlorine-containing compound, copper salts, p-toluenesulfonic acid, and water. The persulfate is at least one selected from a group consisting of ammonium persulfate, sodium persulfate, and potassium persulfate. The fluorine-containing compound is at least one selected from a group consisting of ammonium fluoride, sodium fluoride, potassium fluoride, ammonium bifluoride, sodium bifluoride, and potassium bifluoride.
申请公布号 KR20120015488(A) 申请公布日期 2012.02.22
申请号 KR20100077625 申请日期 2010.08.12
申请人 DONGWOO FINE-CHEM CO., LTD. 发明人 PARK, YOUNG CHUL;LEE, SUCK JUN;KANG, KYOUNG MIN;JANG, SANG HOON
分类号 C09K13/08;C23F1/18 主分类号 C09K13/08
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