| 摘要 |
PROBLEM TO BE SOLVED: To prevent compounded chemicals from changing in characteristics by a method wherein a nozzle main body is provided above a chuck that sucks a wafer, and chemicals or water is supplied to the nozzles of the nozzle main body through pipings. SOLUTION: A nozzle main body 3 is provided above a chuck 2 which sucks a wafer 1. The nozzle main body 3 is composed of a nozzle 5 for chemicals A4, a nozzle 7 for chemicals B6, and a nozzle 9 for pure water 8. A wafer 1 is chucked by the chuck 2. The wafer 1 is rotated at a constant number of revolutions, and chemicals A4 is discharged out through the nozzle 5 of the nozzle main body 3, and chemicals B6 is discharged out through the nozzle 7 at the same time. After a certain time elapses, the chemicals are stopped from being discharged out, and pure water 8 is discharged out from the nozzle 9 of the nozzle main body 3 to rinse the wafer 1. After a certain time elapses, pure wafer 8 is stopped from being discharged out, the wafer 1 is rotated at a high speed to be dried out, and a cleaning operation is finished. By this setup, chemicals are not compounded with a distant compounding machine, so that chemicals are prevented from changing in characteristics.
|
