| 摘要 |
An electrical interconnect for connecting an IC chip to a PCB, the electrical interconnect comprising a first polymer layer 5 defining a first surface; a connection element 9 being attached to the first surface such that it protrudes from the first polymer layer 5, a connection pad 4 separated from the connection element 9 by the first polymer layer 5; and a collection of discrete conductive connections 8 through the first polymer layer 5 such that the connection element 9 and connection pad 4 are coupled together; at least a part of each discrete conductive connection 8 contacts the connection element 9 directly underneath the connection element 9. The connection element 9 is preferably provided as a solder ball 6 with a metal contact 7. The present invention is designed to improve the amount of thermal and/or mechanical stress that each solder element connection can take before failing. |
