发明名称 |
Substrate for mounting IC chip, manufacturing method of substrate for mounting IC chip, device for optical communication, and manufacturing method of device for optical communication |
摘要 |
A device for optical communication including a substrate for mounting an IC chip, and a multilayered printed circuit board. An optical path for transmitting optical signal which penetrates the substrate for mounting an IC chip is formed in the substrate for mounting an IC chip.
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申请公布号 |
US8120040(B2) |
申请公布日期 |
2012.02.21 |
申请号 |
US20100785786 |
申请日期 |
2010.05.24 |
申请人 |
ASAI MOTOO;KODAMA HIROAKI;TANAKA TOYOAKI;IBIDEN CO., LTD. |
发明人 |
ASAI MOTOO;KODAMA HIROAKI;TANAKA TOYOAKI |
分类号 |
H01L29/04;G02B6/43;H05K1/02;H05K1/14;H05K3/28;H05K3/46 |
主分类号 |
H01L29/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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