发明名称 Substrate for mounting IC chip, manufacturing method of substrate for mounting IC chip, device for optical communication, and manufacturing method of device for optical communication
摘要 A device for optical communication including a substrate for mounting an IC chip, and a multilayered printed circuit board. An optical path for transmitting optical signal which penetrates the substrate for mounting an IC chip is formed in the substrate for mounting an IC chip.
申请公布号 US8120040(B2) 申请公布日期 2012.02.21
申请号 US20100785786 申请日期 2010.05.24
申请人 ASAI MOTOO;KODAMA HIROAKI;TANAKA TOYOAKI;IBIDEN CO., LTD. 发明人 ASAI MOTOO;KODAMA HIROAKI;TANAKA TOYOAKI
分类号 H01L29/04;G02B6/43;H05K1/02;H05K1/14;H05K3/28;H05K3/46 主分类号 H01L29/04
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