发明名称 |
Semiconductor chip, wafer stack package using the same, and methods of manufacturing the same |
摘要 |
A semiconductor chip comprises a substrate including a front surface and a rear surface, the substrate having a first via hole formed in the front surface and a second via hole formed in the rear surface, a first conductive plug formed on the substrate, the first conductive plug including a first portion formed in the first via hole and a second portion protruding from the front surface of the substrate, and a second conductive plug formed on the first conductive plug, the second conductive plug having a smaller cross-sectional area than the first conductive plug.
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申请公布号 |
US8119448(B2) |
申请公布日期 |
2012.02.21 |
申请号 |
US20100817304 |
申请日期 |
2010.06.17 |
申请人 |
HWANG SON-KWAN;LEE IN-YOUNG;LEE HO-JIN;JANG DONG-HYEON;SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
HWANG SON-KWAN;LEE IN-YOUNG;LEE HO-JIN;JANG DONG-HYEON |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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