发明名称 |
Semiconductor package and method of manufacturing the same, and semiconductor device and method of manufacturing the same |
摘要 |
A semiconductor package of the present invention, includes a wiring substrate, a lead pin fixed to a connection pad on one surface side of the wiring substrate by solder, and a reinforcing resin layer formed on a surface of the wiring substrate on which the lead pin is provided and having a projection-shaped resin portion which projects locally around the lead pin and covers a side surface of a base portion side of the lead pin. The projection-shaped resin portion has a top surface extending from an outer peripheral portion of the lead pin to an outside, and a side surface constituting a non-identical surface to the top surface.
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申请公布号 |
US8120166(B2) |
申请公布日期 |
2012.02.21 |
申请号 |
US20090512277 |
申请日期 |
2009.07.30 |
申请人 |
KOIZUMI NAOYUKI;TATEIWA AKIHIKO;SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
KOIZUMI NAOYUKI;TATEIWA AKIHIKO |
分类号 |
H01L23/538 |
主分类号 |
H01L23/538 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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