发明名称 |
Integrated circuit package system with dual connectivity |
摘要 |
An integrated circuit package system includes: forming a die-attach paddle, a terminal pad, and an external interconnect with the external interconnect below the terminal pad; connecting an integrated circuit die with the terminal pad and the external interconnect; and forming an encapsulation, having a first side and a second side at an opposing side to the first side, surrounding the integrated circuit die with the terminal pad exposed at the first side and the external interconnect extending below the second side.
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申请公布号 |
US8120150(B2) |
申请公布日期 |
2012.02.21 |
申请号 |
US20070857402 |
申请日期 |
2007.09.18 |
申请人 |
BADAKERE GOVINDAIAH GURUPRASAD;CAMACHO ZIGMUND RAMIREZ;PUNZALAN JEFFREY D.;BATHAN HENRY DESCALZO;TAY LIONEL CHIEN HUI;STATS CHIPPAC LTD. |
发明人 |
BADAKERE GOVINDAIAH GURUPRASAD;CAMACHO ZIGMUND RAMIREZ;PUNZALAN JEFFREY D.;BATHAN HENRY DESCALZO;TAY LIONEL CHIEN HUI |
分类号 |
H01L23/495;H01L21/44 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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