发明名称 Semiconductor memory device and manufacturing method therefor
摘要 First gate electrodes of memory cell transistors are formed in series with each other on a semiconductor substrate. A second gate electrode of a first selection transistor is formed adjacent to one end of the first electrodes. A third gate electrode of a second selection transistor is formed adjacent to the second electrode. A fourth gate electrode of a peripheral transistor is formed on the substrate. First, second, and third sidewall films are formed on side surfaces of the second, third, and fourth gate electrodes, respectively. A film thickness of the third sidewall film is larger than that of the first and second sidewall films. A space between the first electrode and the second electrode is larger than a space between the first electrodes, and a space between the second electrode and the third electrode is larger than a space between the first electrode and the second electrode.
申请公布号 US8120092(B2) 申请公布日期 2012.02.21
申请号 US20090565181 申请日期 2009.09.23
申请人 SATO ATSUHIRO;ARAI FUMITAKA;KABUSHIKI KAISHA TOSHIBA 发明人 SATO ATSUHIRO;ARAI FUMITAKA
分类号 H01L29/76;H01L29/94;H01L31/062;H01L31/113;H01L31/119 主分类号 H01L29/76
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