发明名称 Circuit board
摘要 A circuit board has a low thermal expansion coefficient that suits the thermal expansion coefficient of an element to be mounted thereupon and can prevent the occurrence of delamination and cracking of a core layer when the circuit board is used in a low temperature environment. The circuit board is constructed by laminating a core layer and at least one wiring layer, where the at least one wiring layer has slightly smaller external dimensions in a planar direction than the core layer.
申请公布号 US8119923(B2) 申请公布日期 2012.02.21
申请号 US20080188257 申请日期 2008.08.08
申请人 YOSHIMURA HIDEAKI;FUKUZONO KENJI;IIDA KENJI;ABE TOMOYUKI;MAEHARA YASUTOMO;NAKAGAWA TAKASHI;HIRANO SHIN;KANDA TAKASHI;FUJITSU LIMITED 发明人 YOSHIMURA HIDEAKI;FUKUZONO KENJI;IIDA KENJI;ABE TOMOYUKI;MAEHARA YASUTOMO;NAKAGAWA TAKASHI;HIRANO SHIN;KANDA TAKASHI
分类号 H05K1/00;B32B9/00 主分类号 H05K1/00
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