发明名称 Core substrate and printed wiring board
摘要 The core layer of a core substrate is made of carbon fibers impregnated with resin. When the temperature of the core layer increases, the core layer suffers from an increase in the thickness because of thermal expansion of the resin. The core layer is sandwiched between the insulating layers containing glass fibers. The insulating layers serve to suppress an increase in the thickness of the core layer resulting from the thermal expansion of the core layer. Thermal stress is suppressed in the core substrate.
申请公布号 US8119925(B2) 申请公布日期 2012.02.21
申请号 US20090390010 申请日期 2009.02.20
申请人 YOSHIMURA HIDEAKI;IIDA KENJI;ABE TOMOYUKI;MAEHARA YASUTOMO;NAKAGAWA TAKASHI;HIRANO SHIN;FUJITSU LIMITED 发明人 YOSHIMURA HIDEAKI;IIDA KENJI;ABE TOMOYUKI;MAEHARA YASUTOMO;NAKAGAWA TAKASHI;HIRANO SHIN
分类号 H05K1/00 主分类号 H05K1/00
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