ACTIVE IC CHIP EMBEDDED MULTILAYER FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: A multi-layer flexible PCB(Printed Circuit Board) with an electric device and an adhesive material and a manufacturing method thereof are provided to prevent a delamination phenomenon and improve reliability by forming a barrier layer on a contact surface of an electric device which is touched with an adhesive material. CONSTITUTION: Circuit patterns(111,121) are formed on both sides of a first FCCL(110) and a second FCCL(Flexible Copper Clad Laminate)(120). An IC chip(140) is mounted on a chip bonding pad(112) at an internal layer of the first FCCL in a flip chip bonding type. A barrier layer(160) is formed at an upper side of the IC chip. An adhesive material(130) is inserted between the first FCCL and the second FCCL. A via hole(150) electrically connects a circuit pattern of the first FCCL and the second FCCL.