发明名称 |
Wafer transferring apparatus, polishing apparatus, and wafer receiving method |
摘要 |
A wafer transferring apparatus includes a top ring for holding a wafer on a lower end surface thereof and a pusher mechanism for transferring the wafer to and from the top ring. The pusher mechanism has a wafer rest for placing the wafer thereon and is arranged to allow the wafer released from the lower end surface of the top ring to be seated on the wafer rest. The pusher mechanism also has a sensor mechanism for detecting when the wafer is properly seated on the wafer rest. The sensor mechanism is adapted to block sensor light emitted from a light-emitting device by the wafer seated on the wafer rest.
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申请公布号 |
US8118640(B2) |
申请公布日期 |
2012.02.21 |
申请号 |
US20060918254 |
申请日期 |
2006.04.20 |
申请人 |
TAKAHASHI NOBUYUKI;SONE TADAKAZU;KOBAYASHI TAKUJI;TORII HIROOMI;EBARA CORPORATION |
发明人 |
TAKAHASHI NOBUYUKI;SONE TADAKAZU;KOBAYASHI TAKUJI;TORII HIROOMI |
分类号 |
B24B49/00;B24B37/04;H01L21/304;H01L21/677 |
主分类号 |
B24B49/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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