Method for fabricating semiconductor device with damascene bit line

摘要

A method for fabricating a semiconductor device includes forming an interlayer dielectric layer over a substrate; forming a dual storage node contact plug to be buried in the interlayer dielectric layer, forming a first damascene pattern to isolate the dual storage node contact plug, forming a protective layer pattern inside the first damascene pattern, etching the interlayer dielectric layer to form a second damascene pattern to be coupled to the first damascene pattern, and forming bit lines inside the first and second damascene patterns.