SEMICONDUCTOR APPARATUS HAVING THROUGH VIAS

摘要

PURPOSE: A semiconductor device for including a through electrode is provided to improve a performance characteristic while reducing a size of a package by including a memory chip in one package and a control circuit. CONSTITUTION: A logic chip(100) includes a memory control circuit, a first through electrode(164), and a second through electrode(165). The first through electrode is interposed between the memory control circuit and a memory chip(200). The second through electrode is electrically insulated with the memory control circuit. The memory chip is laminated on the logic chip. The first through electrode connects the memory control circuit to the memory chip.