发明名称 |
Electronic component mounting structure and method for manufacturing the same |
摘要 |
An electronic component mounting structure includes an electronic component provided with a plurality of electrode terminals, and a mounting substrate provided with connector terminals in positions corresponding to the electrode terminals. An electrode terminal is connected to a connector terminal via a protrusion electrode disposed on the electrode terminal or the connector terminal, and the protrusion electrode includes a conductive filler and a photosensitive resin. The photosensitive resin varies in resin component crosslink density in the height direction of the protrusion electrode.
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申请公布号 |
US8120188(B2) |
申请公布日期 |
2012.02.21 |
申请号 |
US20070515425 |
申请日期 |
2007.11.20 |
申请人 |
SAKURAI DAISUKE;YAGI YOSHIHIKO;PANASONIC CORPORATION |
发明人 |
SAKURAI DAISUKE;YAGI YOSHIHIKO |
分类号 |
H01L23/485 |
主分类号 |
H01L23/485 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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