发明名称 |
Integrated circuit packaging system with through via die having pedestal and recess and method of manufacture thereof |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: providing a structure having a via filled with conductive material completely through the structure, a recess, and a pedestal portion bordering the recess; mounting a semiconductor device inside the recess in the structure; and encapsulating the structure and the semiconductor device in an encapsulation.
|
申请公布号 |
US8119447(B2) |
申请公布日期 |
2012.02.21 |
申请号 |
US20090486271 |
申请日期 |
2009.06.17 |
申请人 |
STATS CHIPPAC LTD. |
发明人 |
PAGAILA REZA ARGENTY;DO BYUNG TAI;CHUA LINDA PEI EE |
分类号 |
H01L21/44;H01L21/48;H01L21/50;H01L23/34;H01L23/48 |
主分类号 |
H01L21/44 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|