发明名称 Pattern defect analysis equipment, pattern defect analysis method and pattern defect analysis program
摘要 A data processing unit acquires a review image including a pattern defect on a substrate, compares the review image with a reference image thereby to extract a defect image, the reference image including no pattern defect, and performs an alignment between the review image and a self-layer design pattern image which is generated from design data belonging to the identical layer in a region corresponding to the review image. The data processing unit, then, based on result of the alignment, generates an another-layer design pattern image which is generated from design data belonging to another layer in the region corresponding to the review image, and, based on a synthesized image of the defect image and the another-layer design pattern image, determines the relative position relationship between the pattern defect and a pattern belonging to another layer, and judges the criticality based on the relative position relationship.
申请公布号 US8121393(B2) 申请公布日期 2012.02.21
申请号 US20090350783 申请日期 2009.01.08
申请人 SATOU NORIO;KOYAMA SUSUMU;SAKAMOTO MASASHI;OBARA KENJI;HITACHI HIGH-TECHNOLOGIES CORPORATION 发明人 SATOU NORIO;KOYAMA SUSUMU;SAKAMOTO MASASHI;OBARA KENJI
分类号 G06K9/00 主分类号 G06K9/00
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