发明名称 Polypropylene resin composition
摘要 There are provided a polypropylene resin composition and a molded article thereof, the composition comprising: 60 to 85% by weight of a propylene homopolymer; and 15 to 40% by weight of an ethylene-α-olefin random copolymer containing 45 to 70 parts by mol of ethylene units, and 30 to 55 parts by mol of α-olefin units, and satisfying the following requirements (1) to (5), (1) the propylene homopolymer has a melting temperature of 163 to 170° C.; (2) the propylene homopolymer contains 0.01% or less of regio defects resulted from a 2,1-insertion and a 1,3-insertion in all propylene units; (3) the polypropylene resin composition has a ratio B/A of 0.9 or more, provided that A (% by weight) is an amount of the ethylene-α-olefin random copolymer contained in the polypropylene resin composition, and B (% by weight) is an amount of soluble parts in xylene at a room temperature contained in the polypropylene resin composition; (4) the ethylene-α-olefin random copolymer has a molecular weight distribution of 2.0 to 4.0; and (5) the ethylene-α-olefin random copolymer contained in the polypropylene resin composition has a shape of a particle, whose volume-average particle diameter is 1.0 μm or less, measured by observing a cross-section of a 0.5 mm-thick sheet with a transmission electron microscopy, the sheet being obtained by hot press-molding the above polypropylene resin composition at 190° C. for 3 minutes under a pressure of 35 kgf/cm2, provided that the cross-section of the above particle has a round shape.
申请公布号 US8119738(B2) 申请公布日期 2012.02.21
申请号 US20070515135 申请日期 2007.12.14
申请人 FUJIWARA YASUKI;KIMATA SHUICHI;OSHIMA HIDEKI;SUMITOMO CHEMICAL COMPANY, LIMITED 发明人 FUJIWARA YASUKI;KIMATA SHUICHI;OSHIMA HIDEKI
分类号 C08F8/00;C08L23/00;C08L23/04;C08L23/10 主分类号 C08F8/00
代理机构 代理人
主权项
地址