发明名称 MANUFACTURING METHOD FOR POWER SUPPLY MODULE CIRCUIT BOARD, POWER SUPPLY MODULE AND MAGNETIC CORE THEREOF.
摘要 <p>A manufacturing method for power supply module circuit board, a power supply module and a magnetic core thereof are provided. The method comprises a portion of the magnetic core of the power supply module is embedded within a circuit board, thereby forming the magnetic core of the power supply module and the circuit board together. And an adhesion surface is formed on a surface of the circuit board. Another portion of the magnetic core of the power supply module is exposed outside of the circuit board. The two portions of the magnetic core of the power supply module are bonded by using glue, thereby achieving electrical connection. The circuit board and the magnetic core thereof are essential components of the power supply module. The method, the power supply module and the magnetic core thereof can save the layout space of the circuit board and facilitate high density miniaturization power supply module design and heat radiation of the magnetic core.</p>
申请公布号 MX2011013414(A) 申请公布日期 2012.02.21
申请号 MX20110013414 申请日期 2011.05.30
申请人 HUAWEI TECHNOLOGIES CO., LTD 发明人 JIAN CHEN;LIANGRONG HUANG;HAILIANG CHEN
分类号 H05K1/18;H01F3/00 主分类号 H05K1/18
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