发明名称 |
Bond pad for wafer and package for CMOS imager |
摘要 |
An electronic packaging having at least one bond pad positioned on a chip for effectuating through-wafer connections to an integrated circuit. The electronic package is equipped with an edge seat between the bond pad region and an active circuit region, and includes a crack stop, which is adapted to protect the arrangement from the entry of deleterious moisture and combination into the active regions of the chip containing the bond pads. |
申请公布号 |
US8119456(B2) |
申请公布日期 |
2012.02.21 |
申请号 |
US20090582298 |
申请日期 |
2009.10.20 |
申请人 |
ADKISSON JAMES W.;GAMBINO JEFFREY P.;JAFFE MARK D.;RASSEL RICHARD L.;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
ADKISSON JAMES W.;GAMBINO JEFFREY P.;JAFFE MARK D.;RASSEL RICHARD L. |
分类号 |
H01L21/00;H01L23/48 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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