发明名称 Method for holding wafers and device for fixing two parallel arranged wafers relative to one another
摘要 The invention relates to a device having a first holding instrument (1) for a first wafer (5) and having a second holding instrument (7) for a second wafer (9) arrangeable parallel to the first wafer (5), the two holding instruments (1, 7) being fixable relative to one another. According to the invention, at least one of the holding instruments (1, 7), preferably both holding instruments (1, 7) respectively, comprises at least one gel film (2, 8) for holding the associated wafer (5, 9). The invention furthermore relates to the use of a gel film for holding integral wafers.
申请公布号 US8118290(B2) 申请公布日期 2012.02.21
申请号 US20070749294 申请日期 2007.05.16
申请人 THALLNER ERICH 发明人 THALLNER ERICH
分类号 B25B11/00;B65D81/07;B65D85/00 主分类号 B25B11/00
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