| 摘要 |
PURPOSE: A light emitting device package and a manufacturing method of a light emitting package body are provided to minimize temperature increase of the light emitting device package during operation by including a body which has excellent heat dissipation properties. CONSTITUTION: A body(10) is formed by including a metal structure(12) and an insulating material(14). The metal structure comprises a first metal structure(12a) located on one side of the body and a second metal structure(12b) located on the other side of the body. A contact hole(16) which penetrates the body is arranged in a first part(A). A light emitting device(50) is electrically connected to first and second electrode layers(41,42). A molding material(60) molds the light emitting device. |
