发明名称 CONTACT-BONDING DEVICE
摘要 A compression bonding device capable of packaging electric components on both sides of a substrate is provided. A compression bonding device 1 includes first and second pressing rubbers 15, 25. Electric components 32, 33 can be simultaneously packaged on the front face and the rear face of a substrate 31 by sandwiching the substrate 31 between the first and second pressing rubbers 15, 25. The electric components 32, 33 are not subjected to a force for horizontally moving them because the first and second pressing rubbers 15, 25 are prevented from horizontal extension by a first dam member 16. Thus, the electric components 32, 33 are connected to the substrate 31 without misalignment, thereby obtaining a highly reliable electric device 30a.
申请公布号 HK1126315(A1) 申请公布日期 2012.02.17
申请号 HK20090104516 申请日期 2009.05.18
申请人 SONY CHEMICAL & INFORMATION DEVICE CORPORATION 发明人 MATSUMURA, TAKASHI
分类号 H01L;H05K 主分类号 H01L
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