| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress exfoliation between adhesive layers when a peeling film is peeled from a wafer processing tape. <P>SOLUTION: A wafer processing tape 1 includes: a peeling film 2; an adhesive layer 3 provided on the peeling film 2; and an adhesive tape 4 arranged on the adhesive layer 3. The adhesive layer 3 is formed so that an outer edge length of a proximity part 3a in a region R formed between an outer edge of the adhesive layer of the adhesive tape 4 and a line running 5 mm inside such outer edge is 6% or more of the outer edge length of the adhesive layer. <P>COPYRIGHT: (C)2012,JPO&INPIT |
