| 发明名称 |
THERMAL PEELING SHEET INTEGRATED FILM FOR SEMICONDUCTOR REAR FACE, METHOD OF COLLECTING SEMICONDUCTOR ELEMENT, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermal peeling sheet integrated film for a semiconductor rear face which can easily be peeled off in picking up a semiconductor element in a manner integrated with a film for the semiconductor rear face, thereby improving a yield and a manufacturing effect. <P>SOLUTION: A thermal peeling sheet integrated film for a semiconductor rear face includes: an adhesive sheet having a base material layer and an adhesive layer; and a film for the semiconductor rear face that is formed on the adhesive layer of the adhesive sheet. The adhesive sheet is a thermal peeling type adhesive sheet whose adhesive force with the film for the semiconductor rear face is decreased by heating. <P>COPYRIGHT: (C)2012,JPO&INPIT |
| 申请公布号 |
JP2012033636(A) |
申请公布日期 |
2012.02.16 |
| 申请号 |
JP20100170919 |
申请日期 |
2010.07.29 |
| 申请人 |
NITTO DENKO CORP |
发明人 |
TAKAMOTO HISAHIDE;SHIGA GOSHI;ASAI FUMITERU |
| 分类号 |
H01L21/301;H01L23/00 |
主分类号 |
H01L21/301 |
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