| 摘要 |
A sputtering apparatus for uniformly eroding a sputtering target is disclosed. The sputtering apparatus includes a substrate, a sputtering target having a first surface facing the substrate, a magnet configured to apply a magnetic field to the sputtering target, and facing a second surface of the sputtering target, a guide rail connected to the magnet configured to support and guide the magnet member, wherein a first portion of the guide rail, corresponding to a central portion of the sputtering target, includes a linear portion in a first direction parallel to the second surface of the sputtering target, and wherein a second portion of the guide rail, corresponding to an edge portion of the sputtering target, includes an inclined portion away from the sputtering target in a second direction perpendicular to the first direction, a screw line formed in the first direction in parallel to the guide rail, and a connector connected to the magnet by an elastic, and configured to move the magnet in the first direction along the screw line. |
