| 摘要 |
<P>PROBLEM TO BE SOLVED: To perform an anodic bonding without damaging a circuit element. <P>SOLUTION: Provided are a manufacturing method and a manufacturing device, both for manufacturing a bonded article by bonding first and second objects to be bonded with each other. The method comprises: a contact step in which a bonding portion of the first object to be bonded is brought into contact with a bonding portion of the second object to be bonded; and a bonding step in which the bonding portions are bonded with each other by locally heating the bonding portions in the entire first and second objects. The bonding step includes passing light, which is allowed to travel in the first object, through the first object and applying the light to the bonding portions where the first and second objects are in contact with each other, thereby heating the bonding portions. <P>COPYRIGHT: (C)2012,JPO&INPIT |
