| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a cooling device capable of guiding temperature variation on both ends of a high-speed channel part into the same direction. <P>SOLUTION: A cooling device includes: a cooling fin which cools heat-generating components by dissipating heat generated by the heat-generating components to outside; a first semiconductor module which is one of the heat-generating components; a second semiconductor module which is one of the heat-generating components; a first heat sink which cools the first semiconductor module; a second heat sink which cools the second semiconductor module; a first heat pipe which thermally connects the cooling fin to the first heat sink; and a second heat pipe which thermally connects the first heat sink to the second heat sink. A junction temperature at the functional upper limit of the first semiconductor module is lower than a junction temperature at the functional upper limit of the second semiconductor module. Also, heat generated by the first semiconductor module is greater than heat generated by the second semiconductor module. <P>COPYRIGHT: (C)2012,JPO&INPIT |
