| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a curable resin composition which has the optical characteristics, heat resistance, and high moldability. <P>SOLUTION: The curable resin composition contains an epoxy ring-opened polymer (A) of a monofunctional epoxy compound that has a polymerizable unsaturated bond group in a side chain, and a compound that has a polymerizable unsaturated bond group, and has an alicyclic structure in the polymer (A) and/or the compound that has a polymerizable unsaturated bond group. <P>COPYRIGHT: (C)2012,JPO&INPIT |
