ELECTROCHEMICAL METHODS FOR WIRE BONDING

摘要

Probe-based methods are provided for wire bonding and joining of structures. The wire bonds are formed via a meniscus-confined electrodeposition technique. The electrodeposition technique of the invention can also be used for fabricating one or more nano-sized or micro-sized elongated structures. The structures extend at least partially upwards from the surface of a substrate, and may extend fully upward from the substrate surface. Apparatus suitable for use with the electrodeposition technique are also provided.