| 摘要 |
The present invention relates to a pre-molded LED light bulb package with its main improvements being: the chip and gold wire outside the chip cup at the top of the traditional conducting bracket is covered with an appropriate quantity of epoxy resin colloid and then baked to form an oblate spheroid, which is inserted into the mold and filled with injection PC or ordinary resin to rapidly condense into LED enclosure package, wherein the special effect of multiple amplified or integrated light source whereby the light source is amplified internally and then gathered externally can be achieved by means of an internal optical amplifying light source effect through the pre-molded oblate spheroid and the convex or concave structure on the upper part of the external injection molded LED enclosure, significantly improving the existing single lighting deflection technology, therefore reducing the time of the packaging process and increasing the output capacity of mass production significantly. |
