发明名称 ELECTROMAGNETIC WAVE SHIELD METHOD OF ELECTRONIC COMPONENT USING ELECTROMAGNETIC WAVE SHIELD FILM FOR ELECTRONIC COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To provide an electromagnetic wave shield method of an electronic component using an electromagnetic wave shield film which is easily connected with a ground pattern, allows visual confirmation of the inside after being stuck and is excellent in shielding property and durability. <P>SOLUTION: The electromagnetic wave shield method of an electronic component is for blocking electromagnetic waves by covering the surface of the electronic component mounted inside an electronic apparatus with an electromagnetic wave shield film. For the electromagnetic wave shield film, a conductor layer having a numerical aperture of 30% or higher is formed on an adhesive resin layer, and the conductor layer is embedded in the resin layer so as to expose the surface of at least a part of the conductor layer. The surface where the conductor layer is formed of the electromagnetic wave shield film is directly stuck to the ground pattern. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012033704(A) 申请公布日期 2012.02.16
申请号 JP20100171929 申请日期 2010.07.30
申请人 HITACHI CHEM CO LTD 发明人 TOSAKA MINORU;SUZUKI KYOSUKE
分类号 H05K9/00 主分类号 H05K9/00
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