| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a cooling apparatus capable of improving cooling efficiency and achieving high-speed cooling processing and to provide a heating apparatus capable of improving heating efficiency and achieving high-speed heating processing. <P>SOLUTION: The cooling apparatus includes: a chamber 211; a substrate carrier 2 for holding a substrate 1, which is carried from a carry-out port of the chamber 211 into a stop position in the chamber 211 and carried out from a carry-out port of the chamber 211; a first cooling plate 3a and a second cooling plate 3b which are respectively arranged on both sides of the substrate carrier 2 carried into the stop position in the chamber 211; a gas discharge port 4 formed at least on either one of the first cooling plate 3a and the second cooling plate 3b to discharge gas to the substrate 1; a gas supply means for supplying gas to the gas discharge port 4; and a moving means for moving the first cooling plate 3a and the second cooling plate 3b so as to be close to the substrate carrier 2. <P>COPYRIGHT: (C)2012,JPO&INPIT |
