| 摘要 |
<P>PROBLEM TO BE SOLVED: To eliminate the use of a bus bar, to which a positive electrode terminal and a negative electrode terminal are joined, in a semiconductor device in which multiple pieces of semiconductor packaging are laminated. <P>SOLUTION: A positive electrode 21 is extended to an end part of a case 19 in the laminating direction X. This structure allows the positive electrodes 21 of the adjacent semiconductor packaging 1 to come in contact with each other and are electrically connected when multiple pieces of the semiconductor packaging 1 are laminated. <P>COPYRIGHT: (C)2012,JPO&INPIT |
