JOINT STRUCTURE MANUFACTURING METHOD, HEATING AND MELTING TREATMENT METHOD, AND SYSTEM FOR THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a soldering method which reduces positional deviations between substrates even though the defluxing process can be omitted.

SOLUTION: A temporary fixing agent 55 is applied to a plurality of substrates 50a and 50b, and the substrates 50a and 50b are heated by a heater 33 in a state in which the substrates 50a and 50b are temporarily fixed to each other via the temporary fixing agent 55. The temporary fixing agent 55 is evaporated before or during melting of a solder 54, and the substrates 50a and 50b are soldered to each other via the molten solder 54.

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