发明名称 METHOD OF MANUFACTURING LAMINATED SUBSTRATE, LAMINATED SUBSTRATE AND PRINTED CIRCUIT BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a laminated substrate that reduces transmission loss in electric signals in the laminated substrate. <P>SOLUTION: The method of manufacturing the laminated substrate comprises: forming a base material 2 including an insulating layer 3 and a conductor 4, in which a circuit pattern is formed, by laminating the conductor 4 on the insulating layer 3; coating the conductor 4 by application with a liquid composition 9 containing a solvent and a liquid crystalline polyester on the base material 2; and then removing the solvent from the liquid composition 9 to form a cover material 5. The liquid crystalline polyester is used that has structural units represented by formulas (1), (2) and (3), and includes 30-50 mol% of (1), 25-35 mol% of (2), and 25-35 mol% of (3), relative to total contents of all structural units, where: (1) -O-Ar<SP POS="POST">1</SP>-CO-, (2) -CO-Ar<SP POS="POST">2</SP>-CO-, and (3) -X-Ar<SP POS="POST">3</SP>-Y-. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012033869(A) 申请公布日期 2012.02.16
申请号 JP20110074432 申请日期 2011.03.30
申请人 SUMITOMO CHEMICAL CO LTD 发明人 ITO TOYOMASA;CHIN SHOHO
分类号 H05K3/28;B05D7/24;B32B15/08;H05K1/03 主分类号 H05K3/28
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