发明名称 STACKED CHIP CAPACITOR AND CIRCUIT BOARD DEVICE AND CIRCUIT BOARD EQUIPPED WITH IT
摘要 <P>PROBLEM TO BE SOLVED: To provide a stacked chip capacitor in which low ESL and high ESR characteristics can be fully satisfied without changing the material. <P>SOLUTION: The stacked chip capacitor comprises a capacitor body having first and second capacitor units arranged along the stacking direction, and a plurality of external electrodes formed on the external surface of the body. The first capacitor unit includes at least a pair of first and second internal electrodes arranged alternately in the body, and the second capacitor unit includes a plurality of third and fourth internal electrodes arranged alternately in the body. The first through fourth internal electrodes are connected with the first through fourth external electrodes. ESL of the first capacitor unit is smaller than that of the second capacitor unit, and ESR of the first capacitor unit is larger than that of the second capacitor unit. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012033977(A) 申请公布日期 2012.02.16
申请号 JP20110248548 申请日期 2011.11.14
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 LEE BYOUNG HWA;WEI SHENG QUAN;JEONG HAE-SOK;PARK DONG-SOEK;PARK SANG-SOO;PARK MIN-CHOL
分类号 H01G4/30;H01G4/12 主分类号 H01G4/30
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