| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an aggregate wiring board having a semiconductor element mounted on a flat wiring board, that can stably provide an electronic device by mounting the board favorably on another circuit board. <P>SOLUTION: An aggregate wiring board 10 comprises: a product block 5 in which compact wiring boards 4 each including a stack of a plurality of insulation resin layers 1a to 1c and conduction layers 2a to 2d, and including a top surface provided with a mount part on which a semiconductor element S is mounted are integrally arranged vertically and horizontally; a frame-shaped marginal region 6 formed integrally around the product block 5; and dummy patterns 8a to 8d including the conduction layers 2a to 2d above and below each of the insulation resin layers 1a to 1c in the marginal region 6. The thermal expansion coefficient of the marginal region 6 is higher in the top surface side than in the lower surface side by increasing the area of the dummy patterns 8a to 8d in the conduction layers 2c and 2d on the lower surface side of the marginal region 6 as compared with the area thereof in the conduction layers 2a and 2b on the upper surface side of the marginal region 6. <P>COPYRIGHT: (C)2012,JPO&INPIT |
