| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide means which easily achieves a desired packaging height in order to improve the reliability of the connection between a package substrate and a circuit substrate by increasing the packaging height of the package substrate relative to the circuit substrate. <P>SOLUTION: A first substrate 27A and a second substrate 24, which have different coefficients of thermal expansion, are heat joined by a solder material 28 to form a circuit substrate unit. The circuit substrate unit includes a spacer 10 arranged between the first substrate 27 and the second substrate 24 and formed by a thermal expansion material 11 and a thermosetting material 12. The curing temperature of the thermosetting material 12 is higher than the melting point of the solder material 28. <P>COPYRIGHT: (C)2012,JPO&INPIT |
