发明名称 PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To provide a printed circuit board and a manufacturing method thereof. <P>SOLUTION: A method of manufacturing a printed circuit board includes: preparing a substrate on which an active region and a non-active region are formed, the non-active region being formed on edges of the active region; printing a resist on a dummy portion corresponding to the non-active region of the substrate by using an inkjet printing system; curing the resist; and performing plating on the active region of the substrate. The present invention can prevent the dummy portions from being unnecessarily plated during performing plating by masking the resist on the dummy portion edge corresponding to the non-active region of the substrate, and thus the manufacturing costs can be reduced. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012033882(A) 申请公布日期 2012.02.16
申请号 JP20110111142 申请日期 2011.05.18
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 KIM ZE-HUN;KWON JI-HAN;SONG HA-YUN;YU YON-SUK;PARK HEE-JIN;KIM CHON-YON;YANG JU-HWAN;CHOE SUN-NAM
分类号 H05K3/28 主分类号 H05K3/28
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