发明名称 |
STITCH BUMP STACKING DESIGN FOR OVERALL PACKAGE SIZE REDUCTION FOR MULTIPLE STACK |
摘要 |
A method for die stacking is disclosed. In one embodiment a first die is formed overlying a substrate. A first wire is bonded to the first die and to a bond finger of the substrate, wherein the first wire is bonded to the bond finger with a first bond. A first stitch bump is formed overlying the first stitch bond, wherein the first stitch bump is formed from a molten ball of conductive material. A second die is formed overlying the first die. A second wire is bonded to the second die and to the first stitch bump, wherein the second wire is bonded to the first stitch bump with a second bond.
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申请公布号 |
US2012038059(A1) |
申请公布日期 |
2012.02.16 |
申请号 |
US20100853856 |
申请日期 |
2010.08.10 |
申请人 |
CHIN LAI NGUK;HO FOONG YUE;NAM WONG KWET;LUON KOO ENG;FOONG SALLY;GUAN KEVIN |
发明人 |
CHIN LAI NGUK;HO FOONG YUE;NAM WONG KWET;LUON KOO ENG;FOONG SALLY;GUAN KEVIN |
分类号 |
H01L23/49;H01L21/50 |
主分类号 |
H01L23/49 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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