发明名称 |
SEMICONDUCTOR PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE HAVING THE SAME |
摘要 |
A semiconductor package may include a package substrate having a first surface and a boundary that may be defined by edges of the package substrate. The package further includes a first semiconductor chip having a front surface and a back surface. The back surface of a first portion of the first semiconductor chip may be disposed on the first surface of the package substrate with the back surface of a second portion of the first semiconductor chip extending beyond of the defined boundary of the package substrate. The semiconductor package may also include a second semiconductor chip disposed on the back surface of the second portion of the first semiconductor chip that extends beyond the defined boundary of the package substrate. |
申请公布号 |
US2012038035(A1) |
申请公布日期 |
2012.02.16 |
申请号 |
US201113072746 |
申请日期 |
2011.03.27 |
申请人 |
CHANG WON-GI;PARK TAE-SUNG;SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
CHANG WON-GI;PARK TAE-SUNG |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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