CHEMICAL-MECHANICAL POLISHING MANDREL DEVICE

摘要

A chemical-mechanical polishing mandrel device is disclosed. The device comprises polishing mandrel autorotation mechanisms (2), a turret mechanism (3) and silicon wafer absorption mechanisms, wherein the turret mechanism (3) connects with the polishing mandrel autorotation mechanisms (2) by four link elevating mechanisms. The invention can always keep polishing heads perpendicular to polishing tables (43), and has the advantages of simple structure, easy control for mandrel force, high machining precision, high work efficiency and convenient use; the invention has broad uses, and is particularly suitable for being used on chemical-mechanical polishing (CMP) equipments for silicon wafers, and is also suitable for being used on other machining equipments for processing semiconductor or other material with process requirements similar to CMP for silicon wafers.