METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, ELECTRONIC COMPONENT AND CONDUCTIVE FILM

摘要

Provided is a method for manufacturing an electronic component using a conductive film formed by layering an adhesive layer and a release layer. The method for manufacturing the electronic component having a wiring includes: disposing an adhesive film formed by layering an adhesive layer and a release layer above a substrate having a surface on which a wiring is formed, such that the adhesive layer faces the surface; cutting the adhesive layer by inserting the wiring into the adhesive layer by depressing the adhesive film to the substrate; separating one adhesive layer portion of the cut adhesive layer from the surface; and releasing the release layer from the other adhesive layer portion of the cut adhesive layer.