发明名称 |
Method for Producing an Electrical Circuit and Electrical Circuit |
摘要 |
A method for producing an electrical circuit having at least one semiconductor chip is disclosed. The method includes forming a wiring layer at a contact side of the at least one semiconductor chip, which is encapsulated with a potting compound apart from the contact side. The wiring layer has at least one conductor loop for the purpose of forming an electrical coil.
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申请公布号 |
US2012038065(A1) |
申请公布日期 |
2012.02.16 |
申请号 |
US201113206271 |
申请日期 |
2011.08.09 |
申请人 |
BUTZ JUERGEN;FRANKE AXEL;HAAG FRIEDER;WEBER HERIBERT;HOECHST ARNIM;KNIES SONJA;ROBERT BOSCH GMBH |
发明人 |
BUTZ JUERGEN;FRANKE AXEL;HAAG FRIEDER;WEBER HERIBERT;HOECHST ARNIM;KNIES SONJA |
分类号 |
H01L21/56;H01L23/498 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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