发明名称 LED PACKAGE
摘要 A LED package includes a LED chip, a first phosphor layer, a second phosphor layer, a transparent adhesive and a lens. The lens includes an inner surface and an exterior surface. The first phosphor layer is mounted on the LED chip. The transparent adhesive is filled between the LED chip and the lens. The second phosphor layer is mounted on one of the inner surface and the exterior surface of the lens. Each of the first phosphor layer and the second phosphor layer is of one color.
申请公布号 US2012038268(A1) 申请公布日期 2012.02.16
申请号 US20100938377 申请日期 2010.11.03
申请人 HUANG HSIN-FEI;FOXSEMICON INTEGRATED TECHNOLOGY, INC. 发明人 HUANG HSIN-FEI
分类号 H01J1/62 主分类号 H01J1/62
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