发明名称 MEMS DEVICE HAVING SUPPORT STRUCTURE AND METHOD OF FABRICATING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a MEMS device having a support structure and a method of fabricating the same. <P>SOLUTION: Embodiments of MEMS devices includes a conductive movable layer spaced apart from a conductive fixed layer by a gap, and supported by rigid support structures, or rivets, overlying depressions in the conductive movable layer, or by posts underlying depressions in the conductive movable layer. In certain embodiments, portions of the rivet structures extend through the movable layer and contact underlying layers. In other embodiments, the material used to form the rigid support structures may also be used to passivate otherwise exposed electrical leads in electrical connection with the MEMS devices, protecting the electrical leads from damage or other interference. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012030362(A) 申请公布日期 2012.02.16
申请号 JP20110237032 申请日期 2011.10.28
申请人 QUALCOMM MEMS TECHNOLOGIES INC 发明人 CHUI CLARENCE;CHUN WON SUK;GANTI SURYA PRAKASH;KOTHARI MANISH;MILES MARK W;SAMPSELL JEFFREY B;SASAGAWA TERUO
分类号 B81C1/00;B81B3/00;G02B26/06 主分类号 B81C1/00
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