FILM FOR FLIP-CHIP TYPE SEMICONDUCTOR REAR FACE, AND USE THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a film for a flip-chip type semiconductor rear face, capable of preventing formation of a stain even when flux adheres to the film, and manufacturing a semiconductor device excellent in appearance.

SOLUTION: A film for a flip-chip type semiconductor rear face is arranged on a rear face of a semiconductor element flip-chip connected on a substrate, and includes an adhesive layer and a protective layer laminated on the adhesive layer. The protective layer comprises a heat resistant resin having a glass transition temperature of 200°C or more or metal.

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